Sylvia Diestel and Nick Engehausen presented current research results to 175 participants at this year's wood-based materials colloquium at the Institute of Wood Technology in Dresden (IHD). Together with Dr. Hans Korte, Sylvia Diestel presented the results of morphological and mechanical-physical investigations from the DBU-funded project on Lignoloc wooden nails, which has now been completed.
Nick Engehausen presented test results on the influence of chipboard size and the surface-specific amount of adhesive on the properties of chipboard. In addition to researching basic correlations, the industrial project with the short title "3VER" aims to integrate 3D chip measurement into the chipboard process.
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