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Institute of

HF Wood Research


Three-dimensional particle measurement and process integration in particleboard production

Measuring device for three-dimensional size measurement
© Jürgen Bartels
Measuring device for three-dimensional size measurement

Influence of particle geometry on material properties and optimization of material consumption

The properties of particleboard are influenced to a large extent by the geometry of the chips. Targeted control of the board properties therefore requires precise knowledge of these relationships and their adaptability. The accurate and reliable measurement of chips has only recently become possible and will be further developed in this project with practical relevance.

Background and Objective

The production of the chips depends on many factors, e.g. the degree of wear of the knives in the chipper, the initial condition of the wood or the production speed. There is a connection to the properties of the produced board, but also to the consumption of adhesive during production, since the quantity is currently usually calculated on the basis of weight, although the surface area is independent of this. Thus, there is a lack of precise knowledge of the volume-specific information. With the development of a measuring device for three-dimensional size measurement, the shape of the particles can now be reliably determined, but the exact relationship between geometry and board properties is still largely unknown. The production of optimized chips tailored to this can help to significantly reduce the consumption of resources while maintaining the properties of the plate, i.e. to make production more efficient. The goal is self-regulating, high-performance production with significant cost and material savings.


Depending on the chips produced, the board properties are determined so that the relationship between particle geometry and properties can be represented. At the same time, the adhesive application is adjusted via the volume calculations with the aim of achieving a constant plate quality.

Involved external Thünen-Partners

  • Fagus-GreCon Greten GmbH & Co. KG
    (Alfeld, Deutschland)

Funding Body

  • Federal Ministry of Food und Agriculture (BMEL)
    (national, öffentlich)


12.2021 - 11.2024

Publications to the project

  1. 0

    Benthien JT, Engehausen N, Lüdtke J (2022) 3D-Spanvermessung mit Laser-Profilsensoren : Betrachtung von Technologie, Potenzial im Prozess und Leistungsdaten hinsichtlich der Messkopfauswahl. Holz Zentralbl 148(32):541-543

  2. 1

    Benthien JT, Sieburg-Rockel IJ, Engehausen N, Koch G, Lüdtke J (2022) Analysis of adhesive distribution over particles according to their size and potential savings from particle surface determination. Fibers MDPI 10(11):97, DOI:10.3390/fib10110097

  3. 2

    Benthien JT, Heldner S, Lüdtke J (2019) Spandicke bildanalytisch messen : Thünen-Institut für Holzforschung und Grecon entwickeln System zur 3D-Vermessung von Spänen. Holz Zentralbl 145(38):800

  4. 3

    Benthien JT, Heldner S, Lüdtke J (2019) Vorteile durch bildanalytisches Messen der Spandicken : Neue Technik zur Überwachung der Spangeometrie vereinfacht Steuerung und Optimierung des Spanplattenprozesses. Holz Zentralbl 145(50):1101-1103

  5. 4

    Benthien JT, Lüdtke J, Friehmelt R, Schäfer M (2018) Technical Note: Limitations of a 3-D image analysis-based particle size measuring system for wood particle dimension measurement [online]. Wood Fiber Sci 50(3):358-362, zu finden in <> [zitiert am 05.11.2018]

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